Stacked dies with overhang tend to bend and twist during wire bonding process. ASMPT’s wire bonders are equipped with special hardware and software features to bond the ultra-thin over hang dies.
- Overhang capability
- Process Features
- Digital control bond head with closed-loop force feedback
- Ultra low loop trajectories < 50μm
- Built-in looping database
- Programmable focus
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Bond Head
Enabling Factors for stacked die wire bonding
- Industry’s best in motion and impact control
- Intelligent zPS technology
- Lower mass and inertia
- Sub pico bonding of sensing
Low Loop
- ASMPT unique looping database allows users to load and save a set of qualified looping parameters from/to wire bonder looping library
- Field proven low loop trajectories
- Stable and consistent looping performance
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Die Bonding
ISLinDAWire Bonding
Eagle Xpress GoCu 
TwinEagle Xpress GoCu ?
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