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Group Structure

  • ASM Pacific Technology

    • Semiconductor Solution Segment

      • Wire bonders
      • Die bonders
      • Encapsulation solutions
      • Test handlers
      • Clip bonders,
      • CIS ?equipment
      • TCB bonders
      • Flip chip bonders
      • Mold Under Fill (MUF)
      • Panel molding
      • Laser grooving and dicing

    Materials

      • Leadframes
      • Advanced packaging materials (molded interconnect substrates)

    SMT Solutions

      • Assembly line solutions
      • DEK printing systems
      • SIPLACE placement systems
      • ASM smart factory tools & services
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